Wire-to-board (Crimp style/IDC) / Wire-to-wire (Crimp style/IDC)
Based upon wire-to-board crimp style PA connectors, the PA series family of connector have been expanded to meet the requirement of complex wire harness of 2.0 mm pitch connectors with secure locking mechanism thanks to the additional line up of wire-to-board IDC style PAF connectors and wire-to-wire crimp style PAL connectors.
Based upon wire-to-board crimp style PA connectors, the PA series family of connector have been expanded to meet the requirement of complex wire harness of 2.0 mm pitch connectors with secure locking mechanism thanks to the additional line up of wire-to-board IDC style PAF connectors and wire-to-wire crimp style PAL connectors.
Unit of Measure
Specifications
Available |
N/A {0} |
Manufacturer Stock |
N/A {0} |
Brands |
N/A JST |
Manufacturer |
N/A JST |
Series |
N/A PA |
Pitch Size |
N/A 2.0 mm0.079 in |
Mounting Type |
N/A Retainer Mountable Type Crimp |
Industry Standards |
N/A Canadian Standards Association (CSA®) Certified LR20812 Restriction of Hazardous Substances (RoHS) Underwriters Laboratories (UL) Recognized E60389 |
Circuits |
N/A 10 |
Quantity Per Reel |
N/A 1000 |
Alternating Current (AC) Rating1 | N/A 3 A |
Direct Current (DC) Rating2 | N/A 3 A |
Alternating Current (AC) Voltage Rating |
N/A 100 V |
Direct Current (DC) Voltage Rating |
N/A 100 V |
Temperature Range3 | N/A -25 to +85 ºC |
Maximum Contact Resistance After Environmental Testing |
N/A 25 mΩ |
Minimum Initial Insulation Resistance |
N/A 1000 MΩ |
Withstanding Alternating Current (AC) Voltage Per Minute |
N/A 800 V |
Applicable Wire Size |
N/A 28 to 22 AWG |
Material and Finish
Post Material |
N/A Brass, Copper-Undercoated, Tin-Plated |
Wafer Material |
N/A Natural Ivory Polyamide Resin, UL94V-0 |
Solder Tab Material |
N/A Brass, Copper-Undercoated, Tin-Plated |
Features
Features |
N/A
|
- 1 AWG #22
- 2 AWG #22
- 3 Including temperature rise in applying electrical current
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