This MOSFET has been designed to minimize the on-state resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.
Unit of Measure
Specifications
|
Mechanical Data
|
Maximum Ratings (at TA= +25 Degree Celsius (ºC) Unless Otherwise Specified)
|
Thermal Characteristics (at TA = +25 Degree Celsius (ºC), Unless Otherwise Specified)
|
Electrical Characteristics (Tamb = 25 Degree Celsius (ºC), Unless Otherwise Specified)
|
Features
|
Applications
|
Note
Specifications
Available |
N/A {0} |
Manufacturer Stock |
N/A {0} |
Brands |
N/A Diodes Incorporated® |
Manufacturer |
N/A Diodes Incorporated� |
Approximate Weight |
N/A 0.008 g |
Industry Standards |
N/A Flammability: Underwriters Laboratories (UL) 94V-0 Restriction of Hazardous Substances (RoHS) Compliant |
Mechanical Data
Case |
N/A SOT23 |
Case Material |
N/A Molded Plastic, "Green" Molding Compound. |
Terminals |
N/A Matte Tin Finish |
Maximum Ratings (at TA= +25 Degree Celsius (ºC) Unless Otherwise Specified)
Drain-Source Voltage (VDSS) |
N/A 100 V |
Gate-Source Voltage (VGSS) |
N/A ±20 V |
Steady State Continuous Drain Current (ID) at VGS = 10 Volt (V); TA= +25 Degree Celsius (ºC) Temperature |
N/A 0.7 A0.8 A |
Steady State Continuous Drain Current (ID) at VGS = 10 Volt (V); TA= +70 Degree Celsius (ºC) Temperature |
N/A 0.6 A |
Steady State Continuous Drain Current (ID) at VGS = 10 Volt (V); TA= +100 Degree Celsius (ºC) Temperature |
N/A 0.5 A |
Pulsed Drain Current (IDM) |
N/A 3.5 A |
Body Diode Continuous Source Current (IS) |
N/A 0.5 A |
Body Diode Pulsed Source Current (ISM) |
N/A 3.5 A |
Thermal Characteristics (at TA = +25 Degree Celsius (ºC), Unless Otherwise Specified)
Power Dissipation (PD) |
N/A 625 mW806 mW |
Thermal Resistance, Junction to Ambient (RθJA) |
N/A 155 ºC/W200 ºC/W |
Thermal Resistance, Junction to Leads (RθJL) |
N/A 194 ºC/W |
Operating and Storage Temperature Range (TJ, TSTG) |
N/A -55 to +150 ºC |
Electrical Characteristics (Tamb = 25 Degree Celsius (ºC), Unless Otherwise Specified)
Minimum Drain-Source Breakdown Voltage (BVDSS) at VGS = 0 Volt (V), ID = 250 Microampere (µA) |
N/A 100 V |
Maximum Zero Gate Voltage Drain Current (IDSS) TJ = +25 Degree Celsius (ºC) at VDS = 100 Volt (V), VGS = 0 Volt (V) |
N/A 1 µA |
Maximum Gate-Source Leakage (IGSS) at VGS = ±20 Volt (V), VDS = 0 Volt (V) |
N/A 100 nA |
Features
Features |
N/A
|
Applications
Applications |
N/A
|
Note
Note |
N/A
Note for Continuous Drain Current, Power Dissipation, and Thermal Resistance, Junction to Ambient: For a device surface mounted on 25 mm x 25 mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. For a device surface mounted on FR4 PCB measured at t ≤ 10 sec. Note for Pulsed Drain Current and Pulsed Source Current (Body Diode): Repetitive rating - 25 mm x 25 mm FR4 PCB, D = 0.02, pulse width 300 μs – pulse width limited by maximum junction temperature. |
We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.Ok