American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
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