Projections Unlimited, Inc
PUI | Global Corporate HQ
15311 Barranca Parkway
Irvine , CA , 92618
United States
Phone:(714) 544-2700
Email: sales@gopui.com
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Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The SOT-223 package is designed for surface-mounting using vapor phase, infrared, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of greater than 1.25 W is possible in a typical surface mount application.
Unit of Measure

Specifications

Available

 N/A {0}

Manufacturer Stock

 N/A {0}

Brands

 N/A VISHAY®

Manufacturer

 N/A VISHAY�

Industry Standards

 N/A Restriction of Hazardous Substances (RoHS) Compliant

Absolute Maximum Ratings (TC = 25 Degree Celsius (ºC), Unless Otherwise Noted)

Drain-Source Voltage (VDS)

 N/A 100 V

Gate-Source Voltage Tolerance (±) (VGS)

 N/A 20 V
Continuous Drain Current (ID) at TC = 25 Degree Celsius (ºC) Temperature1 N/A 1.5 A
Continuous Drain Current (ID) at TC = 100 Degree Celsius (ºC) Temperature2 N/A 0.96 A
Pulsed Drain Current (IDM)3 N/A 12 A

Linear Derating Factor

 N/A 0.025 W/ºC
Linear Derating Factor (Printed Circuit Board Mount)4 N/A 0.017 W/ºC
Single Pulse Avalanche Energy (EAS)5 N/A 150 MJ
Avalanche Current (IAR)6 N/A 1.5 A
Repetitive Avalanche Energy (EAR)7 N/A 0.31 MJ

Maximum Power Dissipation (PD) at TC = 25 Degree Celsius (ºC) Temperature

 N/A 3.1 W
Maximum Power Dissipation (PD) at TC = 25 Degree Celsius (ºC) Temperature (Printed Circuit Board Mount)8 N/A 2 W
Peak Diode Recovery (dV/dt)9 N/A 5.5 V/ns

Operational Junction and Storage Temperature Range (Tj = Tstg)

 N/A -55 to 150 ºC
Soldering Recommendations (Peak Temperature)10 N/A 300 ºC

Thermal Resistance Ratings

Maximum Thermal Resistance Junction to Ambient (RthJA) (Printed Circuit Board Mount)11 N/A 60 ºC/W

Maximum Thermal Resistance (Junction to Case (Drain)) (RthJC)

 N/A 40 ºC/W

Features

Features

 N/A
  • Surface-mount
  • Available in tape and reel
  • Dynamic dV/dt rating
  • Repetitive avalanche rated
  • Fast switching
  • Ease of paralleling
  • Simple drive requirements

Note

Note

 N/A Lead-Free
Halogen-Free
  • 1 VGS at 10 V
  • 2 VGS at 10 V
  • 3 Repetitive rating; pulse width limited by maximum junction temperature
  • 4 When mounted on 1" square PCB (FR-4 or G-10 material)
  • 5 VDD = 25 V, starting TJ = 25 ºC, L = 25 mH, Rg = 25 ?, IAS = 3.0 A
  • 6 Repetitive rating; pulse width limited by maximum junction temperature
  • 7 Repetitive rating; pulse width limited by maximum junction temperature
  • 8 When mounted on 1" square PCB (FR-4 or G-10 material)
  • 9 ISD ≤ 5.6 A, dI/dt ≤ 75 A/µs, VDD ≤ VDS, TJ ≤ 150 ºC
  • 10 1.6 mm from case
  • 11 When mounted on 1" square PCB (FR-4 or G-10 material)