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ADTSM Series Mechanical Contact Style Square Stems with Cap
Unit of Measure

Specifications

Available

Manufacturer Stock

Brands

APEM

Manufacturer

APEM

Series

ADTSM

Type

Surface Mount

Size

12 x 12 mm

Dimension H

7.3 mm (SQ.) x 3.8 mm

Color

Brown, 160gf

Soldering

Lead Free

Package Style

Bulk Pack

Materials

Cover Material

Stainless Steel

Base Material

UL94-V0, Nylon Thermoplastic

Base Color

Black

Stem Material

UL94V-0 Nylon Thermoplastic

Stem Color

Black (100gf) Brown (160gf) Red (260gf) Salmon (320gf) Yellow (520gf)

Silicone Rubber Color

Red (300gf)

Contact Disc Material

Phosphor Bronze with Silver Cladding

Cap Material

Thermoplastic Acrylonitrile Butadiene Styrene (ABS)

Terminal Material

Brass with Silver Plating

Electrical Specifications

Electrical Life

200000 cycles

Rating

50 mA

Direct Current (DC) Voltage

12 V

Maximum Contact Resistance

100 mΩ

Minimum Insulation Resistance at 500 Volt (V) Direct Current (DC) Voltage

100 MΩ

Dielectric Strength Alternating Current (AC) Voltage Per 1 Minute (min)

250 V

Contact Arrangement

1 Pole 1 Throw

Mechanical Specifications

Operational Force

160 + 50gf Brown

Stop Strength

Max 3kgf vertical static load continuously for 15 seconds.

Stoke

0.35 + 0.1 mm

Operating Temperature Range

-25 to 70 ºC

Storage Temperature Range

-30 to 80 ºC

Vibration Resistance

Directions: X,Y,Z, three mutually perpendicular directions. Frequency: 10-55-10Hz/1minute. MIL-STD-202F METHOD 201A. Time: 2 hours each direction. High reliability.

Shock Resistance

Directions: X,Y,Z, three mutually perpendicular directions Frequency: 10-55-10 Hz/1minute MIL-STD-202F Method 213B Time: 2 hours each direction. High reliability

Soldering Processes

Wave Soldering

Recommended solder temperature at 500 ºF (260 ºC) max. 5 seconds subject to PCB 1.6 mm thickness. (For through hole type)

Hand Soldering

Use a soldering iron of 30 watts, controlled at 350 ºC approximately 5 seconds while applying solder.

Features

Features

  • Positive tactile feedback.
  • Ultraminiature structure suitable for high density mounting. Economic but high reliability.
  • Insert molded terminals prevent flux build-up during soldering.

Note

Note

Specifications subject to change without notice.