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High Current Density Surface Mount
Ultra Low VF = 0.25 V at IF = 5 A
Unit of Measure

Specifications

Available

 N/A {0}

Manufacturer Stock

 N/A {0}

Brands

 N/A VISHAY®

Manufacturer

 N/A VISHAY�

Series

 N/A eSMP®

Typical Height

 N/A 1.1 mm

Industry Standards

 N/A Restriction of Hazardous Substances (RoHS) Compliant

Mechanical Data

Case

 N/A SMPC (TO-277A)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade

Terminals

 N/A Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test

Maximum Ratings (at TA= +25 Degree Celsius (ºC) Unless Otherwise Specified)

Device Marking Code

 N/A 25N6

Average Forward Current (IF(AV))

 N/A 25 A

Maximum Temperature (TJ)

 N/A 150 ºC

Circuit Configuration

 N/A Single Pole Double Throw (SPDT)

Maximum Repetitive Peak Reverse Voltage (VRRM)

 N/A 60 V

Maximum Average Forward Rectified Current (IF)

 N/A Mounted on 30 mm x 30 mm pad areas aluminum PCB: 25 Ampere (A)
Free air, mounted on recommended copper pad area: 6.4 Ampere (A)

Maximum Direct Current (DC) Reverse Voltage (VDC)

 N/A 45 V
Peak Forward Surge Current (IFSM)1 N/A 300 A

Operating Junction And Storage Temperature Range (TJ, TSTG)

 N/A -40 to +150 ºC

Electrical Characteristics (at TA=25 Degree Celsius (ºC) Temperature Unless Otherwise Noted)

Typical Instantaneous Forward Voltage (VF) at IF = 5.0 Ampere (A), TA = 25 Degree Celsius (ºC) Temperature

 N/A 0.37 V

Typical Instantaneous Forward Voltage (VF) at IF = 12.5 Ampere (A), TA = 25 Degree Celsius (ºC) Temperature

 N/A 0.43 V

Typical Instantaneous Forward Voltage (VF) at IF = 25 Ampere (A), TA = 25 Degree Celsius (ºC) Temperature

 N/A 0.51 V

Maximum Instantaneous Forward Voltage (VF) at IF = 25 Ampere (A), TA = 25 Degree Celsius (ºC) Temperature

 N/A 0.59 V

Typical Instantaneous Forward Voltage (VF) at IF = 5.0 Ampere (A), TA = 125 Degree Celsius (ºC) Temperature

 N/A 0.25 V

Typical Instantaneous Forward Voltage (VF) at IF = 12.5 Ampere (A), TA = 125 Degree Celsius (ºC) Temperature

 N/A 0.35 V

Typical Instantaneous Forward Voltage (VF) at IF = 25 Ampere (A), TA = 125 Degree Celsius (ºC) Temperature

 N/A 0.45 V

Maximum Instantaneous Forward Voltage (VF) at IF = 25 Ampere (A), TA = 125 Degree Celsius (ºC) Temperature

 N/A 0.53 V

Typical Reverse Current (IR) at VR = 45 Volts (V), TA = 25 Degree Celsius (ºC) Temperature

 N/A 133 µA

Typical Reverse Current (IR) at VR = 45 Volts (V), TA = 125 Degree Celsius (ºC) Temperature

 N/A 59 mA

Maximum Reverse Current (IR) at VR = 60 Volts (V), TA = 25 Degree Celsius (ºC) Temperature

 N/A 6000 µA

Typical Reverse Current (IR) at VR = 60 Volts (V), TA = 125 Degree Celsius (ºC) Temperature

 N/A 140 mA

Maximum Reverse Current (IR) at VR = 60 Volts (V), TA = 125 Degree Celsius (ºC) Temperature

 N/A 300 mA

Thermal Characteristics (at TA = +25 Degree Celsius (ºC), Unless Otherwise Specified)

Typical Thermal Resistance Junction to Ambient (RθJA)2 N/A 68 ºC/W
Typical Thermal Resistance Junction to Mount (RθJM)3 N/A 4 ºC/W

Features

Features

 N/A
  • Very low profile - typical height of 1.1 mm
  • Ideal for automated placement
  • Trench MOS Schottky technology
  • Low forward voltage drop, low power losses
  • High efficiency operation
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 ºC

Applications

Applications

 N/A For use in low voltage high frequency DC/DC converters, freewheeling, and polarity protection applications.

Note

Note

 N/A Note for Instantaneous forward voltage: Pulse test: 300 µs pulse width, 1 % duty cycle
Note for Reverse current: Pulse test: pulse width ≤ 5 ms
Specification is subject to change without notice. The products described herein and this document are subject to specific disclaimers.
  • 1 110 ms single half sine-wave superimposed on rated load
  • 2 Free air, mounted on recommended copper pad area; thermal resistance RθJA - junction to ambient.
    The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA.
  • 3 Mounted on 30 mm x 30 mm pad areas aluminum PCB; thermal resistance RθJM - junction to mount measured at cathode side.