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For P.C. board and heat sink mounting.
  • Integrally molded heat sink
  • Provides low thermal resistance
  • Space saving in-line design
Unit of Measure

Specifications

Available

 N/A {0}

Manufacturer Stock

 N/A {0}

Brands

 N/A EDI®

Manufacturer

 N/A EDI�

Peak Reverse Voltage (PRV) per Leg

 N/A 600 V

Number of Phase

 N/A 1

Rectifier Type

 N/A Full Wave Bridge

Industry Standards

 N/A Recognized Component Mark (RU®) Underwriters Laboratories (UL)

Electrical Characteristics Per Leg (at TA=25 Degree Celsius (ºC) Temperature Unless Otherwise Noted)

Average Output Current (Io) at 65 Degree Celsius (ºC) Temperature1 N/A 10 A

Maximum Forward Voltage Drop (Vf) at Forward Current (If) = 2.5 Ampere (A)

 N/A 1 V

Maximum Direct Reverse Current (IR) at Peak Reverse Voltage (PRV)

 N/A 10 µA

Maximum Direct Reverse Current (IR) at Peak Reverse Voltage (PRV) and 100 Degree Celsius (ºC) Temperature

 N/A 300 µA

Maximum Peak Surge Current at IFSM (8.3 Millisecond (ms) Time))

 N/A 300 A

Typical Thermal Resistance (Rθj-c)

 N/A 4.5 ºC/W

Ambient Operating Temperature Range (TA)

 N/A -55 to +150 ºC

Storage Temperature Range (TSTG)

 N/A -55 to +150 ºC

Note

Note

 N/A Maximum lead and terminal temperature for soldering, 3/8 inch from case 5 seconds at 250 ºC.

EDI® reserves the right to change these specifications at any time without notice.
  • 1 Derate Io by 20 % for capacitive loads.