Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%.
Unit of Measure

Specifications

Available

Manufacturer Stock

Brands

Diodes Incorporated®

Manufacturer

Diodes Incorporated�

Approximate SMA Weight

0.064 g

Approximate SMB Weight

0.093 g

Industry Standards

Flammability: Underwriters Laboratories (UL) 94V-0 Restriction of Hazardous Substances (RoHS) Compliant

Mechanical Data

Case

SMA/SMB

Case Material

Molded Plastic

Moisture Sensitivity

Level 1 per J-STD-020

Polarity

Cathode Band Cathode Notch

Leads

Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208

Maximum Ratings (at TA= +25 Degree Celsius (ºC) Unless Otherwise Specified)

Peak Repetitive Reverse Voltage (VRRM)

200 V

Working Peak Reverse Voltage (VRWM)

200 V
Direct Current (DC) Blocking Voltage (VR)1 200 V

Root Mean Square (RMS) Reverse Voltage (VR(RMS))

140 V

Average Rectified Output Current (IO) at TT = 110 Degree Celsius (ºC) Temperature

2 A

Non-Repetitive Peak Forward Surge Current (IFSM) 8.3 Millisecond (ms) Single Half Sine-Wave Superimposed on Rated Load

50 A

Thermal Characteristics

Typical Thermal Resistance Junction to Terminal (RθJT2 20 ºC/W

Operating and Storage Temperature Range (TJ, TSTG)

-55 to +150 ºC

Electrical Characteristics (Tamb = 25 Degree Celsius (ºC), Unless Otherwise Specified)

Forward Voltage (VFM) at IF = 2.0 Ampere (A)

0.92 V
Peak Reverse Current at Rated DC Blocking Voltage (IRM) at TA = 25 Degree Celsius (ºC) Temperature3 5 µA

Peak Reverse Current at Rated DC Blocking Voltage (IRM) at TA = 125 Degree Celsius (ºC) Temperature

350 µA
Typical Total Capacitance (CT)4 25 pF
Reverse Recovery Time (trr)5 25 ns

Features

Features

  • Glass Passivated Die Construction
  • Super-Fast Recovery Time for High Efficiency
  • Surge Overload Rating to 50 A Peak
  • Ideally Suited for Automated Assembly
  • Lead-Free Finish/RoHS Compliant:
    EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied.
  • Green Molding Compound (No Halogen and Antimony):
    Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
  • 1 Short duration pulse test used to minimize self-heating effect.
  • 2 Unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink.
  • 3 Short duration pulse test used to minimize self-heating effect.
  • 4 Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.
  • 5 Measured with IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.