The world's first 0.8 mm pitch wire-to-board insulation displacement connector. Side entry type is only 3.9 mm depth and 1.75 mm height after mounting on the PC board, and top entry type is only 2.2 mm depth and 3.9 mm height. Compared to the conventional 1.0 mm pitch SSR connector, occupation space on the board is reduced by 34% (side entry type).
Unit of Measure
Specifications
Available |
N/A {0} |
Manufacturer Stock |
N/A {0} |
Brands |
N/A JST |
Manufacturer |
N/A JST |
Series |
N/A SUR |
Pitch Size |
N/A 0.8 mm |
Industry Standards |
N/A Canadian Standards Association (CSA®) Certified LR20812 Restriction of Hazardous Substances (RoHS) Underwriters Laboratories (UL) Recognized E60389 |
Circuits |
N/A 10 |
Quantity Per Reel |
N/A 3500 |
Alternating Current (AC) Rating for 32 American Wire Gauge (AWG) |
N/A 0.5 A |
Alternating Current (AC) Rating for 36 American Wire Gauge (AWG) |
N/A 0.2 A |
Direct Current (DC) Rating for 32 American Wire Gauge (AWG) |
N/A 0.5 A |
Direct Current (DC) Rating for 36 American Wire Gauge (AWG) |
N/A 0.2 A |
Direct Current (DC) Voltage Rating |
N/A 30 V |
Temperature Range1 | N/A -25 to +85 ºC |
Maximum Contact Resistance After Environmental Testing |
N/A 40 mΩ |
Minimum Insulation Resistance |
N/A 100 MΩ |
Withstanding Alternating Current (AC) Voltage Per Minute |
N/A 200 V |
Applicable Conductor Wire Size |
N/A 32 AWG36 AWG |
Wire |
N/A 7 Strands, Tin-Coated Copper Alloy |
Applicable Insulation Wire Outside Diameter (OD) |
N/A 0.39 mm |
Material and Finish
Contact Material2 | N/A Copper Alloy, Copper-Undercoated, Tin-Plated |
Wafer Material |
N/A Natural Polyamide (PA 66), UL94V-0 |
Solder Tab Material3 | N/A Brass, Copper-Undercoated, Tin-Plated |
- 1 Including temperature rise in applying electrical current
- 2 Reflow treatment
- 3 Reflow treatment
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