Axial Leaded for Switching Circuits
Unit of Measure
Specifications
|
Dimensions
|
Dielectric Strength
|
Life Expectancy
|
Damp Heat Test
|
Resistance to Soldering Heat
|
Long Term Stability
|
Features
|
Applications
Specifications
Available |
N/A {0} |
Manufacturer Stock |
N/A {0} |
Brands |
N/A Cornell Dubilier |
Manufacturer |
N/A Cornell Dubilier |
Working Direct Current (DC) Voltage |
N/A 400 V |
Capacitance |
N/A 10 µF |
dv/dt Rating |
N/A 30 V/µs |
Root Mean Square (RMS) Ripple Current at 100 Kilohertz (kHz), +70 Degree Celsius (ºC) Temperature |
N/A 12 A |
Typical Equivalent Series Resistance (ESR) at 100 Kilohertz (kHz), +25 Degree Celsius (ºC) Temperature |
N/A 6.3 mΩ |
Operating Temperature Range1 | N/A -40 to +100 ºC |
Capacitance Tolerance (±) at 1 Kilohertz (kHz) Frequency, 25 Degree Celsius (ºC) Temperature |
N/A 10 % |
Optional Capacitance Tolerance (±) |
N/A 5 % |
Direct Current Surge Voltage (SVDC) |
N/A 600 V |
Alternating Current (AC) Voltage |
N/A 250 V |
Maximum Dissipation Factor (Tan δ) at 1 Kilohertz (kHz) Frequency and 25 Degree Celsius (ºC) Temperature |
N/A 0.1 % |
Insulation Resistance2 | N/A 30000 MΩ·µF |
Self-Inductance |
N/A <1 Nano-Henry per mm of lead spacing |
Failure Quota |
N/A 300/Billion component hours |
Construction |
N/A Metallized Polypropylene film |
Electrodes |
N/A Vacuum deposited Metal layers |
Coating |
N/A Flame retardant tape wrap (UL510) with epoxy end fill (UL94V-0) |
Lead Terminations |
N/A Lead Free Tinned Copper Leads |
Dielectric Strength
Terminal to Terminal Dielectric Strength |
N/A 160 % VDC applied for 10 Seconds and 25 ºC 200 % of VDC applied for 2 Seconds and 25 ºC |
Terminal to Case Dielectric Strength |
N/A 3 KVAC at 50/60 Hz applied between the terminals and case for 60 Seconds and 25 ºC |
Life Expectancy
Life Expectancy with Direct Current (DC) Voltage |
N/A ≥ 100000 |
Life Expectancy with Alternating Current (DC) Voltage |
N/A ≥ 30000 |
Damp Heat Test
Maximum Capacitance Change (Damp Heat Test) at Temperature=+40 Degree Celsius (ºC) ±2 Degree Celsius (ºC) Temperature |
N/A ≤ 2 % of initially specified value |
Dissipation Factor Change (Damp Heat Test) at Relative Humidity= 93 ±2 % |
N/A ≤ 200 % of initially specified value |
Insulation Resistance (Damp Heat Test) at Test Length= 56 days |
N/A ≥ 50 % of minimum specified value |
Resistance to Soldering Heat
Solder Bath Temperature |
N/A ±5 ºC260 ºC |
Exposure Time |
N/A ±1 seconds10 seconds |
Maximum Capacitance Change (Resistance to Soldering Heat) |
N/A ≤ 1 % of initially measured value |
Dissipation Factor Change (Resistance to Soldering Heat) |
N/A ≤ 0.1 % at 1 kHz |
Insulation Resistance (Resistance to Soldering Heat) |
N/A ≥ 50 % of minimum specified value |
- 1 Above +85ºC applied voltage must be de-rated by 1.5%/ºC
-
2 After 1 minute of 100VDC applied between the terminals at 25ºC
Not to exceed 3 GΩ
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